Detroit Regional Chamber > Chamber > CHIPS for America Funding Opportunity: Commercial Fabrication Facilities

CHIPS for America Funding Opportunity: Commercial Fabrication Facilities

August 24, 2023

CHIPS for America has expanded its current funding announcement to also seek applications for the construction, expansion, or modernization of commercial facilities to fabricate leading-edge, current-generation, and mature-node semiconductors.

For Chamber members interested in applying, the Government Relations team will help you receive a letter of recommendation from your representative. Please reach out to the Chamber’s Manager of Government of Relations, Adam Majestic, at amajestic@detroitchamber.com to learn more.

Learn more about the funding announcement from the National Institute of Standards and Technology below.


CHIPS for America’s first funding opportunity aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This funding opportunity seeks applications for projects for the construction, expansion, or modernization of commercial facilities for the fabrication of leading-edge, current-generation, and mature-node semiconductors.

RELATED: CHIPS Act Passes The House and Senate

As of June 23, 2023, it also seeks applications for the construction, expansion, or modernization of commercial facilities for semiconductor materials and manufacturing equipment, for which the capital investment equals or exceeds $300 million. Two additional funding opportunities—for materials and manufacturing equipment facilities with capital investments below $300 million, and for research and development facilities—will be announced later this year.

Statements of interest from all potential applicants for this and all future funding opportunities are currently being accepted on a rolling basis. 

For potential applications for leading-edge facilities, the CHIPS Program Office is currently accepting pre-applications (optional) and full applications. The CHIPS Program Office is also currently accepting pre-applications (recommended) and full applications for current-generation, mature-node, and back-end production facilities.

For potential applications for semiconductor materials and manufacturing equipment facilities for which the capital investment equals or exceeds $300 million, pre-applications (recommended) will be accepted on a rolling basis beginning Sept. 1, 2023, and full applications will be accepted on a rolling basis beginning October 23, 2023.